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A Novel Thermal-Aware Structure of TSV Cluster
  • 所属机构名称：北京工业大学
  • 会议名称：IEEE 28th International SoC Conference
  • 时间：2015.9.8
  • 成果类型：会议
  • 相关项目：高性能CPU中动态逻辑电路的低功耗方法学研究
同会议论文项目
高性能CPU中动态逻辑电路的低功耗方法学研究
期刊论文 30 会议论文 24 著作 1
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