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A Thermal-Aware Distribution Method of TSV in 3D IC
  • 所属机构名称：北京工业大学
  • 会议名称：The 11th IEEE International Conference on ASIC
  • 时间：2015.11.3
  • 成果类型：会议
  • 相关项目：高性能CPU中动态逻辑电路的低功耗方法学研究
同会议论文项目
高性能CPU中动态逻辑电路的低功耗方法学研究
期刊论文 30 会议论文 24 著作 1
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