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Simplified Empirical Formula on TSV Thermal Analysis for 3D IC EDA
  • 所属机构名称：北京工业大学
  • 会议名称：IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT&#39
  • 时间：2014.11.1
  • 成果类型：会议
  • 相关项目：高性能CPU中动态逻辑电路的低功耗方法学研究
同会议论文项目
高性能CPU中动态逻辑电路的低功耗方法学研究
期刊论文 30 会议论文 24 著作 1
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