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Interfacial Reaction between Sn-9Zn/Sn Double Layers Solder and Cu
  • 所属机构名称：大连理工大学
  • 会议名称：2012 International Conference on Electronic Packaging Technology & High Density Packaging
  • 时间：2012.8.8
  • 成果类型：会议
  • 相关项目：基于同步辐射实时成像研究钎焊过程界面金属间化合物生长行为
作者： MA HT|AN LL|QU L|WANG J|GU LY|HUANG ML|
同会议论文项目
基于同步辐射实时成像研究钎焊过程界面金属间化合物生长行为
期刊论文 10 会议论文 9 获奖 2
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