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Effects of Soldering Temperature and Cooling Rate on the as-Soldered Microstructures of Intermetalli
  • 所属机构名称：大连理工大学
  • 会议名称：12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT
  • 时间：2011
  • 成果类型：会议
  • 相关项目：基于同步辐射实时成像研究钎焊过程界面金属间化合物生长行为
作者： Gu, Liyu|Qu, Lin|Ma, Haitao|Luo, Zhongbing|Wang, Lai|
同会议论文项目
基于同步辐射实时成像研究钎焊过程界面金属间化合物生长行为
期刊论文 10 会议论文 9 获奖 2
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