位置：成果数据库 > 会议 > 会议详情页
Mechanism of Cu6Sn5 layer act as a diffusion barrier layer
  • 所属机构名称：大连理工大学
  • 会议名称：14th International Conference on Electronic Packaging Technology and High Density Packaging
  • 时间：2013.8.8
  • 成果类型：会议
  • 相关项目：基于同步辐射实时成像研究钎焊过程界面金属间化合物生长行为
作者： LI H|QU L|ZHAO HJ|ZHAO N|MA HT|
同会议论文项目
基于同步辐射实时成像研究钎焊过程界面金属间化合物生长行为
期刊论文 10 会议论文 9 获奖 2
同项目会议论文
In-situ study on the formation and evolution behavior of voids at the interface during soldering pro
Interfacial Reaction between Sn-9Zn/Sn Double Layers Solder and Cu
The Effect of Laser-soldering Parameters on the Sn-Ag-Cu/Cu Interfacial Reaction
Effects of Soldering Temperature and Cooling Rate on the as-Soldered Microstructures of Intermetalli
Mechanical Properties and Electrochemical Corrosion Behavior of Al-Cu Solder Joint with Sn-Zn Based
The study on the rapidly-solidified Sn-0.7Cu lead-free solders and the interface reactions with Cu s
The nucleation of Ag3Sn and the growth orientation relationships with Cu6Sn5
The study of cooling process’ effect on the growth of IMC at Sn-3.5Ag/Cu soldering interface