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The study on the rapidly-solidified Sn-0.7Cu lead-free solders and the interface reactions with Cu s
  • 所属机构名称：大连理工大学
  • 会议名称：13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-H
  • 时间：2012.8.8
  • 成果类型：会议
  • 相关项目：基于同步辐射实时成像研究钎焊过程界面金属间化合物生长行为
作者： MA HT|WANG J|QU L|AN LL|GU LY|HUANG ML|
同会议论文项目
基于同步辐射实时成像研究钎焊过程界面金属间化合物生长行为
期刊论文 10 会议论文 9 获奖 2
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