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Effect of Stand-off Height on Microstructure and Tensile Strength of Cu/Sn-8Zn-3Bi/Cu and Cu/Sn-9Zn/
  • 所属机构名称：华中科技大学
  • 会议名称：59th Electronic Components and Technology Conference
  • 成果类型：会议
  • 会场：San Diego, CA
  • 相关项目：微小互连高度下焊点的界面反应及可靠性研究
作者： Wang, Bo|Du, Bin|An, Bing|Wu, Yiping|Wu, Fengshun|Liu, Hui|
同会议论文项目
微小互连高度下焊点的界面反应及可靠性研究
期刊论文 12 会议论文 9
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