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Effect of stand-off height on microstructure and tensile strength of Cu/Sn9Zn/Cu Solder Joint
  • 所属机构名称：华中科技大学
  • 会议名称：10th Electronics Packaging Technology Conference, EPTC 2008
  • 成果类型：会议
  • 会场：Singapore, Singapore
  • 相关项目：微小互连高度下焊点的界面反应及可靠性研究
作者： Du, Bin|An, Bing|Wang, Bo|Wu, Yiping|Wu, Fengshun|
同会议论文项目
微小互连高度下焊点的界面反应及可靠性研究
期刊论文 12 会议论文 9
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