位置：成果数据库 > 会议 > 会议详情页
Effect of thermomigration in eutectic SnPb solder layer
  • 所属机构名称：华中科技大学
  • 会议名称：2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-H
  • 成果类型：会议
  • 会场：Beijing, China
  • 相关项目：微小互连高度下焊点的界面反应及可靠性研究
作者： Lan, Ding|Yuan, Tao|Bing, An|Yuhui, Yao|Yiping, Wu|Fengshun, Wu|
同会议论文项目
微小互连高度下焊点的界面反应及可靠性研究
期刊论文 12 会议论文 9
同项目会议论文
Effect of Cu substrate and solder alloy on the formation of kirkendall voids in the solder joints du
Effect of stand-off height on microstructure and tensile strength of Cu/Sn9Zn/Cu Solder Joint
Effect of miniaturization on the microstructure and mechanical property of solder joints
Effects of thermal aging on the electrical resistance of Sn-3.5Ag micro SOH solder joints
Effect of stand-off height on the reliability of Cu/Sn-4.8Bi-2Ag/Cu solder joint
Effect of Stand-off Height on Microstructure and Tensile Strength of Cu/Sn-8Zn-3Bi/Cu and Cu/Sn-9Zn/
Effect of Stand-off Height on the Microstructure and Fracture Mode of Cu/Sn-9Zn/Cu Solder Joint unde
Evaluate anti-shock property of solder bumps by impact test