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CopperPumping of Through Silicon Vias in Reliability Test
  • 所属机构名称：中国科学院微电子研究所
  • 会议名称：2015 The 16th International Conference on Electronic Packaging Technology (ICEPT)
  • 时间：2015.8.11
  • 成果类型：会议
  • 相关项目：面向高密度三维集成的玻璃等离子体深刻蚀技术研究
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面向高密度三维集成的玻璃等离子体深刻蚀技术研究
期刊论文 2 会议论文 8
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Dry Etching of Fused Silica Glass in C4F8/Ar Inductively Coupled Plasmas for Through Glass Via (TGV)
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Effectof pre-CMP annealing on TSV pumping in thermal budget and reliability test
Investigation of silicon stress around through silicon vias by high efficiency micro-Raman microscop
Effect of Thermal Annealing on TSV Cu Protrusion and Local Stress
Effectof annealing after copper plating on the pumping behavior of through siliconvias