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Interfacial reaction in Cu/Sn/Cu fine pitch interconnect during soldering
  • 所属机构名称：大连理工大学
  • 会议名称：2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013
  • 时间：2013
  • 成果类型：会议
  • 相关项目：单晶基体界面反应及其对微细无铅焊点可靠性的影响
作者： Huang, Mingliang|Liu, Ting|Zhao, Ning|Hao, Hua|
同会议论文项目
单晶基体界面反应及其对微细无铅焊点可靠性的影响
期刊论文 61 会议论文 47 获奖 6 专利 1
同项目会议论文
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