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Simulation of IMC layer growth and Cu consumption in Sn-Ag-xCu/Cu solder joints during reflow
  • 所属机构名称：大连理工大学
  • 会议名称：2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, IC
  • 时间：2012
  • 成果类型：会议
  • 相关项目：单晶基体界面反应及其对微细无铅焊点可靠性的影响
作者： Xiaohui Wang|Mingliang Huang|Fan Yang|Ning Zhao|
同会议论文项目
单晶基体界面反应及其对微细无铅焊点可靠性的影响
期刊论文 61 会议论文 47 获奖 6 专利 1
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