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Effect of Fe addition to Sn-3Ag-0.5Cu solder on interfacial reactions during aging
  • 所属机构名称：大连理工大学
  • 会议名称：2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013
  • 时间：2013
  • 成果类型：会议
  • 相关项目：单晶基体界面反应及其对微细无铅焊点可靠性的影响
同会议论文项目
单晶基体界面反应及其对微细无铅焊点可靠性的影响
期刊论文 61 会议论文 47 获奖 6 专利 1
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