Effects of cooling rate and solder volume on the formation of large Ag 3Sn plates in Sn-Ag based sol
- 所属机构名称:大连理工大学
- 会议名称:2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, IC
- 时间:2012
- 成果类型:会议
- 相关项目:单晶基体界面反应及其对微细无铅焊点可靠性的影响