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Mechanical Reliability Estimation for μBGA Solder Joints Based on Heating Factor Q(eta)
  • 所属机构名称：华中科技大学
  • 会议名称：International Conference on Electronic Packaging Technology and High Density Packaging
  • 成果类型：会议
  • 会场：Shanghai, PEOPLES R CHINA
  • 相关项目：数控技术与数字制造
作者： Tao Bo|Yin Zhouping|Wu Yiping|Ding Han|
同会议论文项目
数控技术与数字制造
期刊论文 36 会议论文 18 获奖 7 专利 14
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