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The analysis and control of pick-and-place process in flip-chip
  • 所属机构名称：华中科技大学
  • 会议名称：Mechanical and Electronics Engineering (ICMEE), 2010 2nd International Conference on
  • 成果类型：会议
  • 会场：京都
  • 相关项目：数控技术与数字制造
作者： Bo Peng|ZhouPing Yin|YouLun Xiong|JianZhou Quan|
同会议论文项目
数控技术与数字制造
期刊论文 36 会议论文 18 获奖 7 专利 14
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