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Packaging and Isolating Microsphere Coupling System
  • 所属机构名称：中北大学
  • 会议名称：6th IEEE International Conference of Nano/Micro Engineered and Molecular Systems
  • 成果类型：会议
  • 会场：TaiWan
  • 相关项目：基于高Q值环形微腔介观力－光耦合效应的芯片级高灵敏度传感器研究
作者： Xiong Jijun|Yan Yingzhan|Liu Jun|Zhang Yuguang|Yan Shubin|Wang Li|Xue Chenyang|
同会议论文项目
基于高Q值环形微腔介观力－光耦合效应的芯片级高灵敏度传感器研究
期刊论文 16 会议论文 19 专利 6
同项目会议论文
Design and Modeling of a Novel Micro-displacement Sensor Based Optical Frequency Comb
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A novel packaging method for stable microsphere coupling system
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Thermal Stress Analysis of The Microtoroid Under CO2 Laser
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芯片级平面环形微腔的表面优化处理研究
平面环形微腔耦合系统的理论分析
星载高灵敏度MOEMS 加速度计设计