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Integrated Algorithm for 3-D IC Through-Silicon Via Assignment
  • ISSN号：1063-8210
  • 期刊名称：IEEE Transactions on Very Large Scale Integration
  • 时间：2014.3
  • 页码：655-666
  • 相关项目：成品率驱动的纳米尺度集成电路设计方法学研究
作者： Liu, Xiaodong|Yeap, Gary|Tao, Jun|Zeng, Xuan|
同期刊论文项目
成品率驱动的纳米尺度集成电路设计方法学研究
期刊论文 30 会议论文 16 获奖 4
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