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Buckling and delamination of Ti/Cu/Si thin film during annealing
  • ISSN号：0361-5235
  • 期刊名称：Journal of Electronic Materials
  • 时间：2014.6.3
  • 页码：3351-3356
  • 相关项目：突破光学组件集成瓶颈的纳米表面形貌在线测量新方法研究
作者： Changsheng Li|Chenying Wang|Zhuangde Jiang|Kely Jiang|
同期刊论文项目
突破光学组件集成瓶颈的纳米表面形貌在线测量新方法研究
期刊论文 26 会议论文 11 专利 5
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