Effects of Parameters in Femtosecond Laser Micromachining on Ablation of Silicon
ISSN号:1006-4982
期刊名称:《天津大学学报:英文版》
时间:0
分类:TN304.12[电子电信—物理电子学] TG665[金属学及工艺—金属切削加工及机床]
作者机构:State Key Laboratory of Precision Measuring Technology and Instruments, Tianjin University, Tianjin 300072, China
相关基金:Supported by National High Technology Research and Development Program of China ( "863" Program) (No. 2006AA04Z327), National Natural Science Foundation of China (No.60372006), and Program for New Century Excellent Talents in University.