中文摘要：

为防止集成电路由于元件相互影响及受到外部干扰而无法正常工作,对高集成度电路板进行绝缘封装必不可少.针对印刷电路板(printedcircuitboard,PCB)上焊点区域小、数量多、位置密集、形态多样等问题,提出基于色彩特征与邻域信息的多形态焊点定位方法.首先通过建立色彩特征模型,提取PCB的单色色度区间特征与多色色差特征;然后提出了基于色彩特征的多形态焊点定位方法,在完成焊点初定位的基础上,采用窗口扫描法提取像素点的邻域信息,进一步提出基于邻域信息的焊点精确定位优化方法,能够有效地提高PCB焊点区域的定位精度.实验结果表明,该方法能大幅提高焊点区域的填充率及滤除误判像素点,满足对PCB上多形态焊点区域的精确定位需求.

英文摘要：

In order to prevent the integrated circuit from inter-inference or external interference of the components,it is necessary to keep the high integration circuit board in the insulated encapsulation.Considering the current Printed Circuit Board(PCB)requires small welding,large quantity,intensive distribution,varied shapes,a color feature and neighborhood information based method is proposed in this paper.A color feature model is first established to extract the features of chromaticity interval and color difference.Afterwards,the multi-shaped solder joints location method based on the color feature is proposed to determine the location of the solder joints.On the basis of solder joint positioning,the window scanning is used to extract the neighborhood information of pixel points.The solder joint location is further optimized based on the neighborhood information,where the positioning accuracy of the PCB solder joint area is improved effectively.It is shown from the test results that the precise positioning requirements of the multi-pattern solder joint area on the PCB could be fulfilled as the proposed method could effectively improve the filling rate of the solder joint areas yet reduce numbers of the misplaced pixel points.