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Effects of Substrate Pulse Bias Duty Cycle on the Microstructure and Mechanical Properties of Ti–Cu–N Films Deposited by Magnetic Field-Enhanced Arc Ion Plating

ISSN号：1006-7191
期刊名称：《金属学报：英文版》
时间：0
分类：TG[金属学及工艺]
作者机构：[1]School of Mechanical and Electrical Engineering, Shenzhen Polytechnic, Shenzhen 518055, China, [2]Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China, [3]Institute of High Current Electronics, Siberian Branch, Russian Academy of Sciences, Akademicheskii pr. 2/3, Tomsk, Russia 634055
相关基金：Acknowledgements This work was supported by the National Natural Science Foundation of China （Grant No. 51401128） and Shenzhen Science and Technology Project （No. JCYJ20140508155916426）.

作者： Sheng-Sheng Zhao, Yan-Hui Zhao, Lv-Sha Cheng, Vladimir Viktorovich Denisov, Nikolay Nikolaevich Koval, Bao-Hai Yu, Hai-Juan Mei

中文摘要：