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Novel method of separating macroporous arrays from p-type silicon substrate
  • 期刊名称:Journal of Semiconductor
  • 时间:2012.4.1
  • 页码:-
  • 分类:TN304.23[电子电信—物理电子学] TQ028.8[化学工程]
  • 作者机构:[1]Key Laboratory of Polar Materials and Devices, Ministry of Education, Department of Electronic Engineering, East ChinaNormal University, Shanghai 200241, China, [2]Department of Physics and Material Sciences, City University ofHong Kong, Tat Chee Avenue, Kowloon, Hong Kong, China
  • 相关基金:Project supported by the Intemational Collaboration Project of China (No. 10520704400), PCSIRT, the National Natural Science Foundation of China (No. 61176108), and the City University ofHong Kong Strategic Research Grant, China (No. 7008009).
  • 相关项目:具有高容量快速充电特性的三维结构薄膜Li离子电池研制
中文摘要:

<正>This paper presents a novel method to fabricate separated macroporous silicon using a single step of photo-assisted electrochemical etching.The method is applied to fabricate silicon microchannel plates in 100 mm p-type silicon wafers,which can be used as electron multipliers and three-dimensional Li-ion microbatteries.Increasing the backside illumination intensity and decreasing the bias simultaneously can generate additional holes during the electrochemical etching which will create lateral etching at the pore tips.In this way the silicon microchannel can be separated from the substrate when the desired depth is reached,then it can be cut into the desired shape by using a laser cutting machine.Also,the mechanism of lateral etching is proposed.

英文摘要:

This paper presents a novel method to fabricate separated macroporous silicon using a single step of photo-assisted electrochemical etching. The method is applied to fabricate silicon microchannel plates in 1 O0 mm p-type silicon wafers, which can be used as electron multipliers and three-dimensional Li-ion microbatteries. Increasing the backside illumination intensity and decreasing the bias simultaneously can generate additional holes during the electrochemical etching which will create lateral etching at the pore tips. In this way the silicon microchannel can be separated from the substrate when the desired depth is reached, then it can be cut into the desired shape by using a laser cutting machine. Also, the mechanism of lateral etching is proposed.

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