中文摘要：

以硅微通道板（Si-MCP）作为基底,采用真空化学镀的方法在其孔道内沉积一层镍铁磷合金层,进而形成一个排列整齐的阵列结构。对这种阵列的形貌进行了研究,发现它是由无数根空心正方形微米线构成。此外,还分别研究了平行于微米线阵列和垂直于微米线阵列的磁滞回线,结果表明样品的易磁化方向是垂直于轴向的,与常规情况不同,这可能是由于硅微通道板表面沉积了过多的合金造成的。最后研究了不同的快速热退火温度对样品矫顽力和矩形比的影响,结果表明矫顽力和矩形比都随着温度升高先减小再增加,在300℃左右时矫顽力和矩形比达到最小,此时软磁性能最好。

英文摘要：

With the silicon microchannel plates（Si-MCP）as the substrate,a NiFeP alloy layer in the channels of the Si-MCP was deposited by the vacuum chemical plating method,then an orderly NiFeP alloy microwire array was formed.The morphology of the array was studied.It is found that the array is composed of a lot of hollow square microwires.In addition,the hysteresis loops parallel and perpendicular to the microwire array were investigated,respectively.The results show that the easy magnetization direction is perpendicular to the axial direction.This situation is different from the general situation and may be caused by the thick alloy layer deposited on the surface of the Si-MCP.Then the effects of the different rapid thermal annealing temperatures on the coercive force and squareness ratio of the sample were studied.The results show that with the increase of the temperature,the coercive force and squareness ratio decrease firstly and then increase,the coercive force and squareness ratio are minimum and the soft magnetic property is best at about 300 ℃.