中文摘要：

通过真空镀铬对金刚石颗粒进行表面改性,采用放电等离子烧结法（SPS）制备改性金刚石/Cu复合材料 研究金刚石的体积分数、工艺参数以及金刚石颗粒表面改性对复合材料导热性能的影响。结果表明,烧结温度、混料时间以及金刚石颗粒的体积分数都会影响材料的致密度,金刚石颗粒的体积分数还会影响材料的界面热阻,而致密度和界面热阻是影响该复合材料导热性能的2个重要因素 对金刚石颗粒进行真空镀铬表面改性,可改善颗粒与铜基体的润湿性,降低界面热阻。在一定的工艺条件下,镀铬金刚石体积分数为60%时,改性金刚石/Cu复合材料具有很高的致密度,其热导率达到503.9W/（m.K）,与未改性的金刚石/Cu复合材料相比,热导率提高近2倍,适合做为高导热电子封装材料。

英文摘要：

Surface modified diamond/Cu composites were fabricated by spark plasma sintering （SPS） using the surface modified diamond plated chrome in vacuum as raw material. The effect of compositional formulating,process parameters and surface modification of diamond particles on the thermal conductivity of the composites was studied. The sintering temperature,mixing time of raw material powder and the valume fraction of diamond particle all have effects on the relative density. Diamond particle volume fraction can affect the thermal boundary resistance of composites. Relative density and thermal boundary resistance are two important factors for the thermal conductivity of the diamond/Cu composites. Surface modification of diamond can improve the wettability between diamond particle and Cu based material,which will reduce the thermal boundary resistance. The high relative density sample with thermal conductivity of 503.9 W.m？2.K？1 can be obtained when the composite containing 60% chrome-plated diamond particles. The thermal conductivity of surface modified diamond is almost increasing two times of the unmodified diamond/Cu composite and suitable to use as high thermal conductivity electronic packaging materials.