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Effect of P and aging on microstructure and shear strength of Sn-2.5Ag-2.0Ni/Ni(P) solder joints
  • ISSN号：0254-0584
  • 期刊名称：Materials Chemistry and Physics
  • 时间：0
  • 页码：259-266
  • 语言：英文
  • 相关项目：高导热DCC材料近净形成形的相关基础问题
作者： Qu, Xuanhui|Rafi-ud-din|Wu, Mao|He, Xinbo|Qin, Mingli|Ren, Shubin|
同期刊论文项目
高导热DCC材料近净形成形的相关基础问题
期刊论文 19 会议论文 1 专利 4
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