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Microstructure and shear strength of solder joints of SiCp/Al composites with Ni plating with Sn-2.5
  • ISSN号：1001-053X
  • 期刊名称：Beijing Keji Daxue Xuebao/Journal of University of
  • 时间：0
  • 页码：884-889
  • 语言：英文
  • 相关项目：高导热DCC材料近净形成形的相关基础问题
作者： He, Xin-Bo|Qu, Xuan-Hui|Wu, Mao|Meng, Fei-Fei|
同期刊论文项目
高导热DCC材料近净形成形的相关基础问题
期刊论文 19 会议论文 1 专利 4
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