中文摘要：

与 d25 μ m 铜丝结合的超声的楔在周围的温度在 Au/Ni plated Cu 底层上被完成。超声的楔结合机制被使用 SEM/EDX 调查，拉测试，砍测试和微硬度试验。结果证明 Au 层变瘦在结合的工具的中心下面直接发生，结合的力量增加。内部在铜丝和 Au 敷金属法之间的散开在结合的楔期间被假定可以忽略，并且结合的楔被完成由穿超声的颤动导致的行动。超声的力量贡献由于然后被结合的铜楔变硬的紧张跟随的超声的弄软的效果提高铜丝的变丑。

英文摘要：

The ultrasonic wedge bonding with d 25 μm copper wire was achieved on Au/Ni plated Cu substrate at ambient temperature. Ultrasonic wedge bonding mechanism was investigated by using SEM/EDX, pull test, shear test and microhardness test. The results show that the thinning of the Au layer occurs directly below the center of the bonding tool with the bonding power increasing. The interdiffusion between copper wire and Au metallization during the wedge bonding is assumed negligible, and the wedge bonding is achieved by wear action induced by ultrasonic vibration. The ultrasonic power contributes to enhance the deformation of copper wire due to ultrasonic softening effect which is then followed by the strain hardening of the copper wedge bonding.