中文摘要：

在铜基体表面电沉积铜-金刚石复合过渡层，采用电镀铜加固突出基体表面的金刚石颗粒，最后利用热丝化学气相沉积（HFCVD）法在复合过渡层上沉积大面积的与基体结合牢固的连续金刚石膜。采用扫描电子显微镜、拉曼光谱和压痕试验对所沉积的金刚石膜的表面形貌、内应力及膜/基结合性能进行研究。结果表明：金刚石膜由粗大的立方八面体颗粒与细小的（111）显露面颗粒组成，细颗粒填充在粗颗粒之间，形成连续的金刚石膜。复合过渡层中的露头金刚石经 CVD 同质外延生长成粗金刚石颗粒，而铜表面与粗金刚石之间的二面角上的二次形核繁衍长大成细金刚石颗粒。金刚石膜/基结合力的增强主要来源于金刚石膜与基体之间形成镶嵌咬合和较低的膜内应力。

英文摘要：

Large area diamond films were fabricated on copper substrates by a multi-step process comprised of electroplating Cu-diamond composite layer on Cu substrate, plating a Cu layer to fix the protruding diamond particles, and depositing continuous diamond film on composite interlayer by hot-filament chemical vapor deposition （HFCVD）. The interface characteristics, internal stress and adhesion strength were investigated by scanning electron microscopy, Raman analysis and indentation test. The results show that the continuous film without cracks is successfully obtained. The microstructure of the film is a mixture of large cubo-octahedron grains grown from homo-epitaxial growth and small grains with （111） apparent facets grown from lateral second nuclei. The improved adhesion between diamond film and substrate results from the deep anchoring of the diamond particles in the Cu matrix and the low residual stress in the film.