中文摘要：

微热压工艺在高深宽比聚合物微型制件成型领域应用较为广泛。利用孔直径为0．3mm、深度为1．5mm的微圆柱阵列模具，研究了高温低压和低温高压2种工艺范围下，高深宽比微圆柱的微热压成型规律。实验结果表明，随着热压温度或热压压力的增大，微圆柱高度均提高；当热压压力为定值时，温度每升高3℃，微圆柱高度最大增值为0．213mm；当热压温度为定值时，热压压力每增加1MPa，微圆柱高度最大增值为0．342mm。微圆柱的深宽比在低温高压组可达4．2，在高温低压组可达2．95，通过二元线性回归分析得到了热压温度和热压压力对微圆柱高度的影响关系，为微热压成型高深宽比聚合物微制件提供了一定的技术依据。

英文摘要：

Micro hot embossing process was widely applied in the forming field of micro-scale polymer products. A mold with an array of through-holes with the diameter of 0.3 mm and depth of 1.5 mm was used to study the micro hot embossing process to form the polymer micro pillars array. The experimental results showed that the height of micro pillars increased gradually, with the increase of the molding temperature or the embossing force. The maximum increment of the micro pillars height was 0. 213 mm for each 3 ~C rise in the molding temperature with the constant embossing force. At a given molding temperature, a rise of 1 MPa in the embossing force will maximally increase the height of micro pillars by about 0. 342 ram. The aspect ratio of micro pillars reached 4.2 in the low-temperature and high-pressure group and 2.95 in the high-temperature and low-pressure group. The relationship of the molding temperature and the embossing force on the height of micro pillars could be obtained by means of binary linear regression analysis, which will provide reference for micro hot embossing process of high aspect ratio polymer micro-parts.