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Wideband modeling and characterization of differential through-silicon vias for 3-D ICs
  • ISSN号：0018-9383
  • 期刊名称：IEEE Transactions on Electron Devices
  • 时间：2016.3.1
  • 页码：1168-1175
  • 相关项目：基于碳纳米管的三维集成电路硅通孔互连线的建模与仿真
作者： Feng Liang|Kuiwen Xu|Xi Chen|Gaofeng Wang|
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基于碳纳米管的三维集成电路硅通孔互连线的建模与仿真
期刊论文 13 会议论文 3
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