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Closed-form impedance model for annular through-silicon via pairs in 3-D integration
  • 期刊名称：IET Microwave, Antennas & Propagation
  • 时间：2015.6.1
  • 页码：808-813
  • 相关项目：基于碳纳米管的三维集成电路硅通孔互连线的建模与仿真
作者： Aobo Chen|Feng Liang|Gaofeng Wang|Bing-Zhong Wang|
同期刊论文项目
基于碳纳米管的三维集成电路硅通孔互连线的建模与仿真
期刊论文 13 会议论文 3
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