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A simple thermo-compression bonding setup for wire bonding interconnection in pressure sensor silico
  • ISSN号：0946-7076
  • 期刊名称：Microsystem Technologies
  • 时间：2011.10.1
  • 页码：1629-1633
  • 相关项目：单片集成的弯曲悬臂梁式三轴热对流加速度传感器研究
作者： Quan Wang|Xiaodan Yang|Yanmin Zhang|Jianning Ding|
同期刊论文项目
单片集成的弯曲悬臂梁式三轴热对流加速度传感器研究
期刊论文 19 获奖 1 专利 2 著作 1
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