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Low-voltage silicon chip/glass ring anodic bonding for MEMS device packaging and experimental evalua
  • ISSN号：0268-1900
  • 期刊名称：International Journal of Materials and Product Tec
  • 时间：2011.5.1
  • 页码：121-129
  • 相关项目：单片集成的弯曲悬臂梁式三轴热对流加速度传感器研究
作者： Quan Wang|Ran Hu|Xiaodan Yang|Jianning Ding|
同期刊论文项目
单片集成的弯曲悬臂梁式三轴热对流加速度传感器研究
期刊论文 19 获奖 1 专利 2 著作 1
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