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Thermal Stress in Free-standing Diamond Films with Cr Interlayer Destroyed
  • 期刊名称:Journal of Materials Science & Technology
  • 时间:0
  • 页码:991-995
  • 语言:英文
  • 分类:TQ164.8[化学工程—高温制品工业] TN304.18[电子电信—物理电子学]
  • 作者机构:School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China
  • 相关基金:Acknowledgement This work was supported by the National Natural Science Foundation of China (Grant No. 50471090).
  • 相关项目:单晶CVD金刚石生长过程中形貌不稳定的控制研究
中文摘要:

Corresponding author. Prof.; Tel.: +86 10 62332475; Fax: +86 10 62332336; E-mail address: chengmli@mater.ustb.edu.cn (C.M. Li).

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