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Improvement of Joint Strength of SiCp/Al Metal Matrix Composite in Transient Liquid Phase Bonding Using Cu/Ni/Cu Film Interlayer
  • ISSN号:1005-0302
  • 期刊名称:《材料科学技术学报:英文版》
  • 时间:0
  • 分类:TG407[金属学及工艺—焊接]
  • 作者机构:[1]Department of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China, [2]Department of Mechanical Engineering, Yangzhou University, Yangzhou 225009, China
  • 相关基金:The work was financially supported by the National Natural Science Foundation of China under grant Nos. 50275076 and 50075039.
中文摘要:

SiCp/AI 金属矩阵的表面上的紧缩的氧化物合成(SiCp/AIMMC ) 极大地取决于关节的性质。镶嵌的劈啪作响的目标被使用由血浆侵蚀在 SiCp/AI MMC 的结合的表面上完全蚀刻氧化物。在厚度的 5 妈妈的 Cu/Ni/Cu 电影被磁控管劈啪作响方法在一样的真空房间在干净结合表面上准备,它在结合的短暂液相(TLP ) 作为夹层被扮演过程。与单个 Cu 陪衬和 Ni 陪衬夹层的一样的厚度相比, 200MPa 的 shear 力量在 TLP 结合期间用 Cu/Ni/Cu 电影夹层被获得,它是 89.7% 碱金属的。另外,结合的区域的 homogenization 和在界面的区域的没有粒子分离被联合微观结构的分析发现。扫描电子显微镜学(SEM ) 被用来观察联合接口的显微图。结果证明关节的同质的微观结构被完成,它与碱金属的是类似的。

英文摘要:

The compact oxide on the surface of SiCp/Al metal matrix composite (SiCp/Al MMC) greatly depends on the property of the joint. Inlaid sputtering target was applied to etch the oxide completely on the bonding surface of SiCp/Al MMC by plasma erosion. Cu/Ni/Cu film of 5μm in thickness was prepared by magnetron sputtering method on the clean bonding surface in the same vacuum chamber, which was acted as an interlayer in transient liquid phase (TLP) bonding process. Compared with the same thickness of single Cu foil and Ni foil interlayer, the shear strength of 200 MPa was obtained using Cu/Ni/Cu film interlayer during TLP bonding, which was 89.7% that of base metal. In addition, homogenization of the bonding region and no particle segregation in interfacial region were found by analysis of the joint microstructure. Scanning electron microscopy (SEM) was used to observe the micrograph of the joint interface. The result shows that a homogenous microstructure of joint was achieved, which is similar with that of based metal.

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期刊信息
  • 《材料科学技术学报:英文版》
  • 中国科技核心期刊
  • 主管单位:中国科协
  • 主办单位:中国金属学会
  • 主编:
  • 地址:中国沈阳文化路72号
  • 邮编:110016
  • 邮箱:
  • 电话:024-83978208
  • 国际标准刊号:ISSN:1005-0302
  • 国内统一刊号:ISSN:21-1315/TG
  • 邮发代号:
  • 获奖情况:
  • 国家“双百”期刊
  • 国内外数据库收录:
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  • 被引量:474