位置：成果数据库 > 期刊 > 期刊详情页
Material Removal Mechanism of Chemo-mechanical Grinding (CMG) of Si Wafer by Using Soft Abrasive Gri
  • ISSN号：1013-9826
  • 期刊名称：Key Engineering Materials
  • 时间：0
  • 页码：459-464
  • 语言：英文
  • 相关项目：超薄硬脆晶体基片的耦合能量软磨机理与关键技术研究
作者： Zhou, L.|Lei, M. K.|Guo, D. M.|Kang, R. K.|Tian, Y. B.|
同期刊论文项目
超薄硬脆晶体基片的耦合能量软磨机理与关键技术研究
期刊论文 7 专利 2
同项目期刊论文
Elimination of Surface Scratch / Texture on the Surface of Single Crystal Si Substrate in Chemo-mech
Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers
Study on Grinding Performance of Soft Abrasive Wheel for Silicon Wafer
A novel single step thinning process for extremely thin Si wafers
Study on Subsurface Damage Model of the Ground Monocrystallinge Silicon Wafers
应用软磨料磨削的单晶硅超精密制造技术