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A novel single step thinning process for extremely thin Si wafers
  • ISSN号：1022-6680
  • 期刊名称：Advanced Materials Research
  • 时间：0
  • 页码：434-439
  • 语言：英文
  • 相关项目：超薄硬脆晶体基片的耦合能量软磨机理与关键技术研究
作者： R.K. Kang|L. Zhou|Y.B. Tian|H. Sato|J. Shimizu|
同期刊论文项目
超薄硬脆晶体基片的耦合能量软磨机理与关键技术研究
期刊论文 7 专利 2
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