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Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers
  • ISSN号：1013-9826
  • 期刊名称：Key Engineering Materials
  • 时间：0
  • 页码：36-41
  • 语言：英文
  • 相关项目：超薄硬脆晶体基片的耦合能量软磨机理与关键技术研究
作者： Huo, F. W.|Guo, D. M.|Kang, R. K.|Jin, Z. J.|
同期刊论文项目
超薄硬脆晶体基片的耦合能量软磨机理与关键技术研究
期刊论文 7 专利 2
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