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Effect of zone pressure on wafer bending and fluid lubrication behavior during multi-zone CMP proces
  • ISSN号：0167-9317
  • 期刊名称：Microelectronic Engineering
  • 时间：2013.8
  • 页码：33-38
  • 相关项目：基于电化学的化学机械平坦化终点检测方法及实验研究
作者： Zhao, Dewen|Wang, Tongqing|He, Yongyong|Lu, Xinchun|
同期刊论文项目
基于电化学的化学机械平坦化终点检测方法及实验研究
期刊论文 14 会议论文 2
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