中文摘要：

使用Ti：sapphire飞秒激光（波长为800nm，周期为130fs）在空气中对晶体硅的进行作用，并通过扫瞄电子显微镜测试材料表面加工结果，对飞秒激光作用材料时产生的热影响规律进行了分析。以加工孔为研究对象，论证了飞秒激光在实际加工中的热影响不能完全被忽视的结论，同时给出了10个飞秒激光脉冲对加工孔表面形貌尺寸的热影响规律，获得了保证孔加工质量的最佳激光能量参数范围。

英文摘要：

The interaction of the radiation of Ti： sapphire femtosecond laser （wavelength 800nm, 130fs） on silicon wafers in air was measured using a scanning electron microscopy and thermal influence rule in the surface of material with femtosecond laser miacromachining. Thermal influence can not be ignored in practice by processing hole on the surface of Si. The thermal influence rule of the morphology of the holes is obtained with 10 pulse numbers. The optimal femtosecond laser fluence extension in processing holes is confirmed.