中文摘要：

应用处于近红外区域波段的飞秒激光对宽带隙材料SiC的烧蚀机理及其相互作用过程进行了研究。分别采用扫描电子显微镜（SEM）、表面粗糙度轮廓仪（Talysurf）和光学显微镜（OM）等分析技术对烧蚀区和未烧蚀区的表面微观形貌进行了检测和评价。不仅在烧蚀表面观察到了烧蚀区、定向波纹区和改性区等不同形貌特征,而且对加工阶段进行分离,并求出加工SiC时强烧蚀和弱烧蚀的阈值分别为0.13 J/cm2和0.61 J/cm2。根据实验结果得到了加工参数与烧蚀形貌之间的映射关系,发现入射激光的能量是决定材料去除方式的关键参数。

英文摘要：

The material ablation mechanisms and ablation interaction procedure were studied between the near-infrared femtosecond laser and the wide band-gap hard material SiC.Surface analytical technologies were used,such as Scanning Electro Microscopy（SEM）,Talysurf and Optical Microscopy（OM）,to test and evaluate the surface morphology of untreated and treated regions of the material.The damaged regions exhibited three different zones,named modification,oriented ripples and ablation.By separating the ablation processes in detail,thresholds for gentle and strong ablation stages were 0.13 J/cm2 and 0.61 J/cm2,respectively.The relationship between processing parameters,and the micro-topography was also gained.It is found that the energy of incident laser is the key parameter for deciding ablation way.