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A Study on the Physical Properties and Interfacial Reactions with Cu Substrate of Rapidly Solidified
  • ISSN号：0361-5235
  • 期刊名称：Journal of Electronic Materials
  • 时间：2013.8.8
  • 页码：2686-2695
  • 相关项目：基于同步辐射实时成像研究钎焊过程界面金属间化合物生长行为
作者： Ma, Hai-Tao|Wang, Jie|Qu, Lin|Zhao, Ning|Kunwar, A.|
同期刊论文项目
基于同步辐射实时成像研究钎焊过程界面金属间化合物生长行为
期刊论文 10 会议论文 9 获奖 2
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