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In situ study of the real-time growth behavior of Cu6Sn 5 at the Sn/Cu interface during the solderin
  • ISSN号：1359-6462
  • 期刊名称：Scripta Materialia
  • 时间：2014.2.2
  • 页码：43-46
  • 相关项目：基于同步辐射实时成像研究钎焊过程界面金属间化合物生长行为
作者： QU L|ZHAO N|ZHAO HJ|HUANG MJ|马海涛|
同期刊论文项目
基于同步辐射实时成像研究钎焊过程界面金属间化合物生长行为
期刊论文 10 会议论文 9 获奖 2
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