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Interfacial reactions of sequentially electroplated Au/Sn/Au films on Si chips
  • ISSN号：0267-0836
  • 期刊名称：Materials Science and Technology
  • 时间：2012.7.7
  • 页码：837-843
  • 相关项目：基于同步辐射实时成像研究钎焊过程界面金属间化合物生长行为
作者： Huang, M. L.|Pan, J. L.|Ma, H. T.|Zhao, N.|
同期刊论文项目
基于同步辐射实时成像研究钎焊过程界面金属间化合物生长行为
期刊论文 10 会议论文 9 获奖 2
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