位置：成果数据库 > 期刊 > 期刊详情页
In-situ study on growth behavior of Ag3Sn in Sn-3.5Ag/Cu soldering reaction by synchrotron radiation
  • ISSN号：0925-8388
  • 期刊名称：Journal of Alloys and Compounds
  • 时间：2012.10.10
  • 页码：286-290
  • 相关项目：基于同步辐射实时成像研究钎焊过程界面金属间化合物生长行为
作者： Ma, H. T.|Qu, L.|Huang, M. L.|Gu, L. Y.|Zhao, N.|Wang, L.|
同期刊论文项目
基于同步辐射实时成像研究钎焊过程界面金属间化合物生长行为
期刊论文 10 会议论文 9 获奖 2
同项目期刊论文
A Study on the Physical Properties and Interfacial Reactions with Cu Substrate of Rapidly Solidified
Fe粉对Sn-3Ag-0.5Cu复合钎料组织及性能的影响
Interfacial reactions of sequentially electroplated Au/Sn/Au films on Si chips
CVD nanocrystalline diamond coatings on Ti alloy: A synchrotron-assisted interfacial investigation
Enhanced diamond CVD synthesis on steel substrates modified by ion beam implantation and sputtering
Characters of multicomponent lead-free soldersCharacters of multicomponent lead-free solders
In situ study of the real-time growth behavior of Cu6Sn 5 at the Sn/Cu interface during the solderin
Viscosities and wetting behaviors of Sn-Cu solders