采用瞬间蒸发技术沉积了N型Bi2Te2.85Se0.15热电薄膜,沉积的薄膜厚度在50~400nm范围之间,并在473K进行1小时的真空退火处理。利用X射线衍射(XRD)、场发射扫描电子显微镜(FE-SEM)和能量散射谱(EDS)分别对薄膜的物相结构、表面形貌以及化学计量比进行表征。XRD分析结果显示,薄膜的主要衍射峰与Bi2Te3和Bi2Se3的标准衍射峰一致,沉积薄膜的最强衍射峰为(015),退火后,薄膜的最强衍射峰是(006)。采用表面粗糙度测量仪测定薄膜厚度,薄膜的电阻率采用四探针法在室温下进行测量,在室温下对薄膜的Seebeck系数进行表征。测试结果表明,薄膜为N型传导特性。并考察了薄膜厚度对电阻率及Seebeck系数的影响。
N-type Bi_2Te_2.85Se_0.15 thermoelectric thin films were deposited by flash evaporation method with thickness in the range of 50~400nm.The thin films were annealed at 473 K for one hour.Phase structure,surface morphology and stoichiometric ratio were characterized via X-ray diffractiometry(XRD), field emission scanning electron microscopy(FE-SEM) and energy dispersive spectroscopy(EDS).XRD results show that main diffraction peaks of the thin films are in accord with Bi_2Te_3 and Bi_2Se_3 diffraction peaks.As-deposited thin film shows that the(015) peak is the strongest peak.After annealing,it is observed that the(006) peak is the strongest peak.The thicknesses of thin films was measured by using a surface roughometer.Electrical resistivity of the thin films were measured using four-probe method and the Seebeck coefficient was measured at room temperature.Results show that the thin films are n-type conduction.Effects of film thickness on electrical resistivity and Seebeck coefficient were investigated.