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Influence of current density on the interfacial bond strength of electroformed layers
  • ISSN号：1750-0443
  • 期刊名称：Micro & Nano Letters
  • 时间：2012.5.5
  • 页码：402-406
  • 相关项目：活化与细密的微电铸层界面结合理论与控制方法
作者： Du, Liqun|Li, Yonghui|Liu, Jianfei|
同期刊论文项目
活化与细密的微电铸层界面结合理论与控制方法
期刊论文 16 会议论文 5 专利 3
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