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The effect of soft bake on adhesion property between SU-8 photoresist and Ni substrate by molecular
  • ISSN号：0021-8995
  • 期刊名称：Journal of Applied Polymer Science
  • 时间：2013.3.3
  • 页码：4456-4462
  • 相关项目：活化与细密的微电铸层界面结合理论与控制方法
作者： Zhang, Xiaolei|Du, Liqun|Xu, Zheng|
同期刊论文项目
活化与细密的微电铸层界面结合理论与控制方法
期刊论文 16 会议论文 5 专利 3
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